Bipolar Processes

	Part number	Application, features	Process Description
	20 V, p-n junction isolation	Small and medium-scale integration digital-analogue IC, VDD < 18 V NPN Vertical: bn=150 Uce=28 V РNP Lateral: bр=35 Uсе=45 V РNP Vertical: bр=35 Uсе=45 V I2L gate Capacitors:emitter-base; collector-base; Ме-n+; Ме1-Ме2. Resistors in layers: Isolation; Base; Resistor	Number of masks, pcs. 13 Mean design rule,µm 6.0 Substrate: Si/B-doped/ p-type/ Thk 460/ Res 10/ (111) Buried layers: Si/Sb-doped/ n-type/Thk 5/Res 17; Si/B-doped/ p-type/Thk 1.6/Res510; Epi layer: Si/P-doped/ N-type/ Thk 10/ Res 1.25; Isolation: p-n junction p-base depth, µm 2.4 N+emitter depth, µm 1.7 Emitter size, µm 6 Distance between transistors, µm 6 Switching: contacts 1, µm 4 space line Me 1, µm 13.0 contacts 2, µm 4*4 space line Me 2, µm 12.0
20 V, p-n junction isolation Specifications Tech. support
	15 V, p-n junction isolation	Small and medium-scale integration digital-analogue IC, VDD < 18 V NPN Vertical: bn=150 Uce=28 V РNP Lateral: bр=35 Uсе=45 V РNP Vertical: bр=35 Uсе=45 V Capacitor:Ме-n+emitter Resistors in PolySi layer	Number of masks, pcs. 10-13 Mean design rule,µm 6.0 Substrate: Si/B-doped/ p-type/ Thk 460/ Res 10/ (111) Buried layers: Si/Sb-doped/ n -type/Thk 6.0/Res 20; Si/B-doped/ p-type/Thk 1.95/Res210; Epi layer: Si/ P-doped/ n-type/ Thk 8/ Res 4.5; Isolation: p-n junction p-base depth, µm 2.4 N+emitter depth, µm 1.7 Emitter size, µm 6 Distance between transistors, µm 6 Switching: contacts 1, µm 4 space line Me 1, µm 13
15 V, p-n junction isolation Specifications Tech. support
	Shottky diodes with Mo barrier	Fast silicon Shottky diodes for switched mode power supplies Urev V 40-150 Irev. µa < 250 Idirect max. A 1-30	Number of masks, pcs. 4 Size, mm 0.76x0.76-4x4 Substrate: Si/As-doped/ n-type/Thk 460/Res 0.0035 (111) Epi layer: Si/ P-doped/ n-type/Thk 4.5/Res (0.6-0.8) Isolation: p-n junction with field-type oxide Metallization: Al+Mo+Ti-Ni-Ag
Shottky diodes with Mo barrier Specifications Tech. support
	Bipolar technology for the manufacture of transistors, triacs	IT (on-state) = 2,0 A Ubr = (600-800)V	Substrate: Si/ P-irradiated / Res 35 10 masks (contact, two-side) Base: boron diffusion, depth, µm 35-45 Cathode : phosphorous diffusion, depth, µm 15-18 p-n junction protection: SiPOS, Si3N4, medium temp. PSG Metallization : Al 2,0 mm Passivation: low temp. PSG, Si3N4 Backside: Ti-Ni-Ag
Bipolar technology for the manufacture of transistors, triacs Specifications Tech. support
	Bipolar technology for the manufacture of high-power npn-transistors with Darlington	UCB = (60-70) V UCE = (60-70) V Ic= (2,0-12) A h21E >500	Epi structure: Substrate: Si/ B-doped/ p-type/ Res 0,05/ (111): Thickness of the layer, µm 25-33 Resistivity, Ohm/cm 10-18 6,7 masks (contact) Base: Phosphorous ion implantation, depth, µm 6-8 Emitter: boron diffusion, depth, µm 2,5-5,5 p-n junction protection : SiO2, Ta2O5 Metallization : Al 4, 5 µm Backside: Ti-Ni-Ag
Bipolar technology for the manufacture of high-power npn-transistors with Darlington Specifications Tech. support
	Bipolar technology for the manufacture of npn-transistors with the range of collector current: 7,5÷16 A	UCB = (80-160) V UCE = (30-90) V Ic= (7,5-16) A h21E >15	Epi structure Substrate: Si/B-doped/ p-type/ Res 0,05/ (111): Thickness of Epi layer, µm 25-28 Resistivity, Ohm/cm 8-11 7 masks (contact) Base:Phosphorous ion implantation, depth, µm 4,5-7,5 Emitter: boron diffusion, depth, µm 1,4-2,5 p-n junction protection : SiO2, Ta2,O5 Metallization : Al 4, 0 µm Backside: Ti-Ni-Ag
Bipolar technology for the manufacture of npn-transistors with the range of collector current: 7,5÷16 A Specifications Tech. support
	Bipolar technology for the manufacture of npn-transistors with the range of operating voltages: 200-300 V	UCB = (250-300) V UCE = (200-250) V Ic= (0,4-0,5) A h21E >40	Epi structure Substrate: Si/B-doped/ p-type/ Res 0,03/ (111): Thickness of Epi layer, µm 40-45 Resistivity, Ohm/cm 40-50 7 masks (contact) Base:Phosphorous ion implantation, depth, µm 3-5,5 Emitter: boron diffusion collector-base p-n junction protection : SiPOS Metallization : Al 1,4 µm Backside: Ti-Ni-Sn-Pb-Sn
Bipolar technology for the manufacture of npn-transistors with the range of operating voltages: 200-300 V Specifications Tech. support
	Bipolar technology for the manufacture of high-power npn-transistors with Darlington	UCB = (300-350) V UCE = (150-350) V Ic= (5-15) A h21E >100	Epi structure: Substrate: Si/ Sb-doped/ n-type/Res 0,01 (111): Thickness of Epi layer, µm 27-38 Resistivity, Ohm/cm 8-21 6-7 masks (contact) Base: ion implantation, depth, µm 6-8 Emitter: diffusion, depth, µm 2,5-5,5 collector-base p-n junction protection : SiPOS Metallization : Al 4, 5 µm Backside: Ti-Ni-Ag Passivation: Low temp. PSG
Bipolar technology for the manufacture of high-power npn-transistors with Darlington Specifications Tech. support
	Bipolar technology for the manufacture of high-power npn-transistors with the range of operating voltages: 300-700 V	UCB = (300-700) V UCE = (300-400) V Ic= (0,5-8,0) A h21E =(8-40)	Epi structure Substrate: Si/ Sb-doped/ n-type/Res 0,01 (111): Thickness of Epi layer, µm 50-80 Resistivity, Ohm/cm 40-50 7-8 masks (contact) Base: ion implantation, depth, µm 2,8-4,6 Emitter: diffusion, depth, µm 1,4-2,8 collector-base p-n junction protection: SiPOS Metallization : Al 1,4 ; 4, 5 µm Backside: Ti-Ni-Ag Passivation: Low temp. PSG
Bipolar technology for the manufacture of high-power npn-transistors with the range of operating voltages: 300-700 V Specifications Tech. support
	Bipolar technology for high-power npn-transistors manufacturing with the range of operating voltages: 160-300 V	UCB = (160-300) V UCE = (160-300) V Ic= (0,1-1,5) A h21E > 25	Epi structure: Substrate: Si/Sb-doped/ n-type/Res 0,01 (111): Thickness of Epi layer, µm 35,50 Resistivity, Ohm/cm 23 7-8 masks (contact) Base: ion implantation, depth, µm 2,8-4,6 Emitter: diffusion, depth, µm 1,4-2,8 collector-base p-n junction protection: SiPOS Metallization : Al 1,4 µm Backside: Ti-Ni-Ag (Sn-Pb-Sn) Passivation: low temp. PSG
Bipolar technology for high-power npn-transistors manufacturing with the range of operating voltages: 160-300 V Specifications Tech. support
	Bipolar technology for the manufacture of high-power npn-transistors with operating voltage of 1500 V	UCE = 1500 V UCE = (700-800) V Ic= (5-12) A	Substrate: Si/ P-irradiated /Res 102- 90 8 masks (contact): Base: ion implantation depth, µm 20-26 Emitter : diffusion, depth, µm 10-15 collector-base p-n junction protection : SiPOS Metallization : Al 4, 5 µm Radiation treatment to ensure dynamics Backside matting Backside: Ti-Ni-Ag sputtering
Bipolar technology for the manufacture of high-power npn-transistors with operating voltage of 1500 V Specifications Tech. support
	Bipolar technology for the manufacture of positive and negative polarity voltage regulators, two metallization levels	NPN Vertical: h 21E =(80-200) UCE >=18 V PNP Lateral: h 21E>=40 UCE >=20V Capacitor: n+ - Al Resistors in layer: Base; resistor	Number of masks, pcs. 11-13 Mean design rule,µm 4-5 Substrate: Si/B-doped/ p-type/Thk 460/Res 10/ (111) Buried layers: Si/Sb-doped/ n-type/Thk5/Res17; Si/B-doped/ p-type/Thk 1.6/Res510; Epi layer: Si/P-doped/ n-type/Thk 10/ Res 1,25; Isolation: p-n junction Deep collector, separation and emitter layers have been carried out by method of diffusion. Base, resistor layers – by method of ion implantation Capacitor dielectric: Si oxide or Si nitride p-base depth, µm 1,8÷2,8 N+emitter depth, µm 0,9÷2,2 The first interlayer dielectric: medium temperature PSG+ Si3N4 The second interlayer dielectric: low temperature PSG The first metallization level AlSiCuTi 0,55 µm The second metallization level AlSi, Al 1,4 µm Passivation: low temp. PSG 1,0 µm
Bipolar technology for the manufacture of positive and negative polarity voltage regulators, two metallization levels Specifications Tech. support
	Bipolar technology for the manufacture of voltage regulators of positive and negative polarity, one metallization level	NPN Vertical: h 21E =(100-300) UCE >=38V PNP Lateral: h 21E>=20 UCE >=38V Capacitor: n+ - Al Resistors in layer: Base; resistor	Number of masks, pcs. 7-10 Mean design rule,µm 4-5 Substrate: Si/B-doped/ p-type/Thk 460/Res 10/ (111) Buried layers: Si/Sb-doped/ n-type/Thk5/Res25; Si/Boron-doped/ p-type/Thk 1.6/Res510; Epi layer: Si/P-doped/ n-type/Thk 13,3/ Res 3.6; Isolation: p-n junction p-base depth, µm 1,8÷2,8 N+emitter depth, µm 0,9÷2,2 Deep collector, separation and emitter layers have been carried out by method of diffusion Capacitor dielectric: Si oxide or Si nitride Interlayer dielectric: medium temperature PSG Metallization: Al 1,4 µm Passivation: low temp. PSG 1,0 µm
Bipolar technology for the manufacture of voltage regulators of positive and negative polarity, one metallization level Specifications Tech. support
	5 V, «Isoplanar – 1» “BpI-30-5”	Small and medium-scale integration digital-analogue IC, VDD < 5V NPN transistor vertical: bn =100 Uсе= 8 V PNP transistor lateral: bр =25 Uce=20 V Resistors in layer: Base	Number of masks, pcs. 15 Mean design rule,µm 3.0 Substrate: Si/B-doped/ p-type/Thk 460/Res 10/ (111); Buried layers: Si/Sb-doped/ n-type/Thk 2.5/Res 35; Si/ B-doped/ p-type/Thk 1.95/Res210; Epi layer: Si/P-doped/ n-type/Thk 1.5/Res 0.3; Isolation: LOCOS + p+ - guard rings p-base depth, µm 0.854 N+ emitter depth, µm 0.55 Emitter size, µm 23 Distance between transistors, µm 2 Switching: contacts 1, µm 23 space line Me 1, µm 6.5 contacts 2 , µm 4*4 space line Me 2, µm 10.0
5 V, «Isoplanar – 1» “BpI-30-5” Specifications Tech. support
	40 V, p-n junction isolation “Bp30-40”	Small-scaleintegrationdigital-analogueIC, VDD< 40 V NPNtransistor vertical: bn =150 Uce=48 V РNP transistor lateral: bр =65 Uсе=60 V РNP transistorvertical: bр =60 Uсе=60 V Capacitors:emitter-base; collector-base; Ме-n+; Ме1-Ме2. Resistors in layers: Isolation; Base; Resistor. PolySi	Number of masks, pcs. 8-13 Mean design rule,µm 8.0 Substrate: Si/B-doped/ p-type/Thk 460/Res 10/ (111) Buried layers: Si/Sb-doped/ n-type/Thk 6.0/Res20; Si/B-doped/ p-type/Thk 1.95/Res210 ; Epi layer: Si/P-doped/ n-type/Thk 13/ Res 3.5; Isolation: p-n junction p-base depth, µm 2.0 N+emitter depth, µm 1.7 Emitter size, µm 99 Distance between transistors, mm 4 Switching: contacts 1, µm 33 space line Me 1, µm 9.0 contacts 2, µm 4*4 space line Me 2, µm 14.0
40 V, p-n junction isolation “Bp30-40” Specifications Tech. support
	20 V,p-n junction isolation “Bp30С-20” complementary	Small and medium-scale integration digital-analogue IC, VDD < 18 V NPN transistor vertical: bn=150 Uce=27 V РNP transistor lateral: bр=30 Uсе=35 V РNP transistor vertical: bр=45 Uсе=35 V РNP Vertical with isolated collector: bр=80 Uсе=30 V Capacitors:emitter-base; collector base; Ме-n+; Ме1-Ме2. Resistors in layers: Isolation; Base; Resistor	Number of masks, pcs. 12-14 Mean design rule,µm 6.0 Substrate: Si/B-doped/ p-type/ Thk 460/ Res 10/ (111) Buried layers: Si/Sb-doped/n-type/Thk 6.0/Res 20; Si/ B-doped/p-type/Thk 1.95/Res 210; Epi layer: Si/P-doped/ n-type/ Thk 8/ Res 1.5; Isolation: p-n junction p-base depth, µm 2.0 N+emitter depth, µm 1.7 Emitter size, µm 77 Distance between transistors, µm 4 Switching: contacts 1, µm 33 space line Me 1, µm 9.0 contacts 2, µm 4*4 space line Me 2, µm 12.0
20 V,p-n junction isolation “Bp30С-20” complementary Specifications Tech. support
	0 V, p-n junction isolation “Bp30-20”	Small and medium-scale integration digital-analogue IC, VDD < 18 V NPN transistor vertical: bn=150 Uce=28 V РNP transistor lateral: bр=35 Uсе=45 V РNP transistor vertical: bр=35 Uсе=45 V I2L gate Capacitors:emitter-base; collector-base; Ме-n+; Ме1-Ме2. Resistors in layers: Isolation; Base; Resistor	Number of masks, pcs. 8-13 Mean design rule,µm 6.0 Substrate: Si/B-doped/ p-type/ Thk 460/ Res 10/ (111) Buried layers: Si/ Sb-doped/ n-type/Thk 6.0/Res 20; Si/ B-doped /p-type/Thk 1.95/Res210; Epi layer: Si/ P-doped/ n-type/ Thk 9/ Res 2.0; Isolation: p-n junction p-base depth, µm 2.2 N+emitter depth, µm 1.7 Emitter size, µm 99 Distance between transistors, µm 4 Switching: contacts 1, µm 33 space line Me 1, µm 9.0 contacts 2, µm 4*4 space line Me 2, µm 12.0
0 V, p-n junction isolation “Bp30-20” Specifications Tech. support