CMOS, 0.35 μm, 2 polySi, 3 metals, E2PROM option, 200 mm wafer
CMOS, 0.35 μm, 2 polySi, 3 metals, E2PROM option, 200 mm wafer
- Application, features: Digital IC with EEPROM,<br /><br />Epitaxy =2.4¸6.0 V<br /><br />For low-voltage transistors<br /><br />NMOS: <br /><br />Vtn=0.5 V, Usd >7 V<br /><br />PMOS: <br /><br />Vtр=-0.6 V, Usd >7 V<br /><br />For high-voltage transistors<br /><br />Vtn=0.6 V, Usd >16 V<br /><br />PMOS: <br /><br />Vtр=-0.6 V, Usd >9 V
- Process Description: Number of photolithographies, pcs. 27<br /><br />Design rule, μm 0.35<br /><br />Substrate: 725KDB0,015(100)<br /><br />Epitaxial layer: 15KDB12<br /><br />2 wells<br /><br />Interlayer dielectric:<br /><br />SACVD SiO2 + PC TEOS, μm 1.05 μm<br /><br />Gate SiO2, Å 250<br /><br />Tunnel oxide, Å 75<br /><br />Capacitor dielectric Si3N4, Å 250<br /><br />Channel length<br /><br />NMOS/PMOS, μm 0.35 for low-voltage<br /><br /> transistors<br /><br />NMOS/PMOS, μm 2.5/1.0 for high-voltage<br /><br /> transistors <br /><br />N&P LDD- drains<br /><br />Titanium silicide<br /><br />Metal I,2 Ti/AlCu / Ti /TiN<br /><br />Contacts 1 (W-filled) ø 0.5<br /><br />Metal 1 pitch, μm 0.95<br /><br />Metal 3 Ti/AlCu<br /><br />Contacts 2,3 (W-filled), μm ø 0.5<br /><br />Metal 2 pitch, μm 1.1