Capabilities | INTEGRAL -

Wafer Fab

Wafer Fab - clean rooms and lines for the formation of IC structures and discrete devices on semiconductor wafers

The total production capacities of crystal production, classes 1, 10, 100, 1000 are:

Processing of plates Ø200 mm with design standards of 0.35 microns - 8.4 thousand pieces / year
Processing of plates Ø150 mm with design standards of 0.8 microns - 78.5 thousand pieces / year
Processing of plates Ø100 mm with design standards of 1.2 microns - 355 thousand pieces / year
Processing of plates Ø100 mm with design standards of 2.0 microns - 180 thousand pieces / year

Plate production

ПWafers of single-crystal silicon (PMC) with a diameter of 100, 150, 200 mm
for the production of microelectronic devices:

- with a diameter of 100 mm for microelectronic devices with design standards of more than 1.2 microns;
- with a diameter of 150 mm for microelectronic devices with design standards of 0.8 microns;
- with a diameter of 200 mm for microelectronic devices with design standards of 0.5 - 0.35 microns.

Power:

Production of single-crystal silicon wafers (PMS) for microelectronic devices

- with a diameter of 100 mm - 805 thousand pieces. per year;
- with a diameter of 150 mm - 150 thousand pieces. per year;
- with a diameter of 200 mm - 10 thousand pieces. in year.

Clean rooms:

- class 1 - 195 sq. m.
- class 10 - 920 sq. m.
- class 100 - 1635 sq. m.
- class 1000 - 6500 sq. m.
- class 10000 - 4133 sq. m.
- class 100000 - 16287 sq. m.

Technological possibilities of crystal production:

CMOS technology, 035 µm, 2 PCC, 3 Me
BiCMOS technology, 0.8 µm, 3 PCC, 2 Me
High voltage CMOS technology, 0.8 µm, 2 PCC, 1Me
Bipolar technologies, 1.5…5 µm, 1-2 Me
BiKDMOS, DMOS technologies, 0.8…2 µm, 1 Me
Microwave Bipolar Transistor Technology
Schottky Diode Technology
Planar manufacturing technology of thyristors with counter-diffusion separation
Epitaxial-planar and diffusion-planar technologies for manufacturing silicon semiconductor devices, including high-power high-voltage transistors

Assembly

After creating the necessary semiconductor structure, the plate is cut into individual crystals (chips).
When packaged, the crystals (chips) are glued to a special seat and electrical connections are made with the wire (welding) to the case leads. Then the body is sealed.

Assembly line for packaging discrete devices:

- class: 10000; 24.4 million pieces/year

Assembly line for chip packaging:

- class: 10000;4.5 million pieces/month (plastic cases)

1 million pieces/month (metal-ceramic cases)

- class 100000; 34.5 million pieces/year

Assembly production technologies:

Assembly of microcircuits in plastic cases of the type: SO, DIP, P-SOT223-4-1, P-SOT223-4-2, P-TO-5-11, P-TO-5-12, TO-220AB/5, TO -220AB/7, P-TO-220-7-180, P-TO-220-7-230, SIL-3P, SIL-9P, SIL-9MPF,
DBS-9P, DBS-9MPF, SOT523-1, SIL-13P, SIL-15P, QFP-80, QFP-100

Semiconductor Assembly:

- in plastic cases such as: TO-92, TO-126, TO-218, TO-220, DPACK, D2PACK, IPACK, SOT-23.,
- in glass-to-metal cases such as: TO-3, TO-18, TO-72, Case 22A-01.

Quality Management System

In 2003, at the enterprises that were part of NPO Integral, a quality management system (QMS) was created, implemented and certified that meets the requirements of ISO 9001:2001 (STB ISO 9001:2001) in certification organizations KEMA (Netherlands) and NPRUP "BelGISS" (Republic of Belarus).

The main task of the current quality management systems OJSC "INTEGRAL" - the managing company of the holding "INTEGRAL" is to combine the efforts of all employees for the design, production and sale of high-quality, competitive and technological microelectronic components, medical products and electronic products that best satisfy requirements and demands of consumers.

The QMS of OJSC INTEGRAL, the managing company of the INTEGRAL holding, is constantly being improved and improved, as evidenced by the improvement in the quality of manufacturing products, taking into account the formation of new needs, as well as early warning of possible problems.

In 2021, the distribution area was expanded re-certified in 2020 by the QMS of INTEGRAL OJSC - the managing company of the INTEGRAL holding in relation to the supply of integrated circuits, semiconductor devices, liquid crystal indicators, single-crystal silicon plates, LED lamps, information systems, electronic wall and desktop clocks, electronic stopwatches, electronic stopwatch clocks, cash registers, devices for welding polyethylene film and confirmed its compliance with the requirements of the STB ISO 9001-2015 standard in the National Compliance System of the Republic of Belarus and DIN EN ISO 9001:2015 in the German DAkkS accreditation system.

In 2021 QMS JSC "INTEGRAL" is the managing company of the holding
"INTEGRAL", including the branches "Plant of Semiconductor Devices", "Transistor", Scientific and Technical Center "Belmicrosystems", "Kamerton", is re-certified for compliance with the requirements & nbsp; GOST R ISO 9001-2015 in the Electronsert voluntary certification system and applies to the development and production of electronic component base (integrated circuits and semiconductor devices) for special purposes.

In 2018, OJSC INTEGRAL is the holding's management company
"INTEGRAL", including the branches of the Scientific and Technical Center "Belmicrosystems", "Plant "Electronics" and "Kamerton", created and implemented a quality management system in relation to the design, development, production and maintenance of medical devices, which in 2019 was certified for compliance
GOST ISO 13485-2017 in the National system of conformity assessment of the Republic of Belarus.

The functions of organizing work to ensure the effective functioning of the quality management systems operating in INTEGRAL OJSC - the management company of the INTEGRAL holding, maintaining in working (actual) condition and planning work to improve them are assigned to the quality management service, which also performs the functions technical regulation and standardization, metrological support and quality control of development and manufacturing products at all stages of their life cycle. The service reports directly to the CEO.

For the successful implementation of the tasks assigned to the quality management service, its organizational structure has a compact form and includes five internal structural divisions: the coordinating center, quality management, metrology department, standardization department and the central factory laboratory, reporting directly to the head of the quality management service, who is the representative quality guidelines.

Quality Management Service of JSC "INTEGRAL" - manager the INTEGRAL holding company has subdivisions accredited for compliance with the requirements of GOST ISO / IEC 17025-2019 - a testing center for quality management, a metrology department, a central factory laboratory with areas of accreditation defined by annexes to accreditation certificates.